Blog

CHEMGREEN



09

2025

-

05

Innovative Application of UV/EB Technology in the Manufacturing


Today, with the rapid development of technology, the update speed of 3C electronic products is accelerating day by day

Today, with the rapid development of technology, the update speed of 3C electronic products is accelerating day by day, and consumers' demands for product quality and performance are also getting higher and higher. UV/EB curing technology, with its unique advantages, is playing an increasingly important role in the manufacturing of 3C electronic products, bringing about numerous innovations and changes to the industry. ​
Significant advantages meet the demands of 3C manufacturing
Fast curing, suitable for high-speed production
The manufacturing of 3C electronic products usually requires large-scale and high-speed production to meet the rapid demands of the market. The rapid curing characteristic of UV/EB curing technology is highly compatible with this production mode. During the assembly process of smartphone screens, UV-cured adhesives are used to bond the screen glass and touch layer. Just a few seconds of ultraviolet radiation is needed for the glue to cure, enabling the screen components to quickly move on to the next process and greatly improving production efficiency. Compared with the curing cycle of traditional adhesives that takes several hours or even longer, UV/EB curing technology has increased the production capacity of the production line several times, effectively shortening the time to market for products and helping enterprises seize the initiative in market competition. ​
High precision and high reliability
The internal structure of 3C electronic products is precise, and the requirements for the assembly accuracy and reliability of components are extremely high. UV/EB curing technology can achieve precise curing control, ensuring that adhesives or coatings cure accurately in the designated area and avoiding problems such as glue overflow and sagging. During the chip packaging process, EB curing packaging materials can complete curing in an instant, forming a uniform and dense protective layer, effectively protecting the chip from the influence of the external environment and improving the stability and reliability of the chip. Meanwhile, UV/EB curing coatings have excellent insulating properties, which can prevent internal short circuits in electronic products and ensure their normal operation.

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